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this is information on a product in full production. march 2014 docid022778 rev 2 1/11 HSP062-2 2-line esd protection for high speed lines datasheet - production data figure 1. functional schematic (top view) features ? flow-through routing to keep signal integrity ? ultralarge bandwidth: 4.6 ghz ? ultralow capacitance: 0.6 pf ? low leakage current: 100 na at 25 c ? extended operating junction temperature range: -40 c to 150 c ? rohs compliant benefits ? high esd robustness of the equipment ? suitable for high density boards complies with following standards ? mil-std 883g method 3015-7 class 3b: ?8 kv ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications the HSP062-2 series is designed to protect against electrostatic discharge on sub micron technology circuits driving: ? hdmi 1.3 and 1.4 ? digital video interface ? display port ? usb 3.0 ? serial ata ? ethernet ? hmi description the HSP062-2 is a 2-channel esd array with a rail to rail architecture designed specifically for the protection of high speed differential lines. the ultralow variation of the capacitance ensures very low influence on signal-skew. the large bandwidth makes it compatible with 5 gbps. the HSP062-2p6 is housed in a sot-666, while the HSP062-2m6 is packaged in qfn-6l (1.45 x 1.0 mm) with a 500 m pitch. HSP062-2m6 qfn-6l package HSP062-2p6 sot 666 16 2 5 3 4 i/o1 nc nc gnd v bus i/o2 1 6 2 5 3 4 i/o1 nc gnd v bus i/o2 nc qfn 6 leads sot-666 www.st.com
characteristics HSP062-2 2/11 docid022778 rev 2 1 characteristics table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge 8 kv iec 61000-4-2 air discharge 15 i pp repetitive peak pulse current (8/20 s) 3 a t j operating junction temperature range -40 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics t amb = 25 c symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm leakage current v rm = 3 v 100 na v cl clamping voltage iec 61000-4-2, +8 kv contact (i pp = 30 a), measured at 30 ns 18 v c i/o - gnd capacitance (input/output to ground) v i/o = 0 v, f = 200 to 3000 mhz, v osc = 30 mv 0.6 0.9 pf c i/o - gnd capacitance variation (input/output to ground) v i/o = 0 v f = 200 to 3000 mhz, v osc = 30 mv 0.09 0.17 pf f c cut-off frequency -3 db 4.6 ghz
docid022778 rev 2 3/11 HSP062-2 characteristics 11 figure 2. leakage current versus junction temperature (typical values) figure 3. s21 attenuation measurement tj (c) 0.01 0.10 1.00 10.00 25 50 75 100 125 150 i r (na) v r =v rm = 3 v 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m300.0m 1.0g 3.0g -15.00 -12.00 -9.00 -6.00 -3.00 0.00 io1 io2 f(hz) 4.6 ghz @ -3db db figure 4. eye diagram - hdmi mask at 3.4 gbps per channel (1) (HSP062-2m6) figure 5. eye diagram - hdmi mask at 3.4 gbps per channel (1) (HSP062-2p6) 1. hdmi specification conditions. this inform ation can be provided for other applications . please contact your local st office. 250 mv/div 49 ps/div 250 mv/div 49 ps/div figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 10v/div 100ns/div 10v/div 100ns/div
ordering information scheme HSP062-2 4/11 docid022778 rev 2 2 ordering information scheme figure 8. ordering information scheme hsp 06 2 - 2 x6 high speed line protection breakdown voltage version number of lines package p6 = sot-666 m6 = qfn-6l
docid022778 rev 2 5/11 HSP062-2 package information 11 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 3. sot-666 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.60 0.018 0.024 a3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.27 0.34 0.007 0.011 0.013 d 1.50 1.70 0.059 0.067 e 1.50 1.70 0.059 0.067 e1 1.10 1.30 0.043 0.051 e 0.50 0.020 l1 0.19 0.007 l2 0.10 0.30 0.004 0.012 l3 0.10 0.004 figure 9. footprint recommendations dimensions in mm (inches) figure 10. marking for sot-666 d b l3 l1 e b1 e1 l2 e a a3 0.50 (0.019) 2.60 (0.01) 0.62 (0.024) 0.30 (0.012) 0.99 (0.039) u
package information HSP062-2 6/11 docid022778 rev 2 note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 4. micro qfn 1.45x1.00 6l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.50 0.55 0.60 0.020 0.022 0.024 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 d 1.45 0.057 e 1.00 0.039 e 0.50 0.020 k 0.20 0.008 l 0.30 0.35 0.40 0.012 0.014 0.016 figure 11. footprint recommendations dimensions in mm (inches) figure 12. marking for micro qfn 1.45x1.00 6l e d a a1 e b k l n 1 1 2 2 0.50 [0.020] 0.25 [0.010] 0.65 [0.026] 0.30 [0.012] 1.60 [0.063] s
docid022778 rev 2 7/11 HSP062-2 recommendation on pcb assembly 11 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 13. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 90%. figure 14. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 250 m 650 m 620 m 236 m 15 m 15 m 7m 7m footprint stencil window footprint
recommendation on pcb assembly HSP062-2 8/11 docid022778 rev 2 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
docid022778 rev 2 9/11 HSP062-2 recommendation on pcb assembly 11 4.5 reflow profile figure 15. st ecopack? recommended sold ering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
ordering information HSP062-2 10/11 docid022778 rev 2 5 ordering information 6 revision history table 5. ordering information order code marking package weight base qty delivery mode HSP062-2p6 u sot-666 2.85 mg 3000 tape and reel (7?) HSP062-2m6 s (1) 1. the marking can be rotated by multiple of 90 to differentiate assembly location qfn-6l 2.3 mg 3000 tape and reel (7?) table 6. document revision history date revision changes 07-feb-2012 1 initial release. 19-mar-2014 2 minor text changes.
docid022778 rev 2 11/11 HSP062-2 11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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